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IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
DIP328-014BLF

DIP328-014BLF

CONN IC DIP SOCKET 28POS TIN

Amphenol ICC (FCI)

2,697 -
DIP328-014BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP324-014BLF

DIP324-014BLF

CONN IC DIP SOCKET 24POS TIN

Amphenol ICC (FCI)

3,308 -
DIP324-014BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP328-011BLF

DIP328-011BLF

CONN IC DIP SOCKET 28POS GOLD

Amphenol ICC (FCI)

2,449 -
DIP328-011BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP318-011BLF

DIP318-011BLF

CONN IC DIP SOCKET 18POS GOLD

Amphenol ICC (FCI)

2,323 -
DIP318-011BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP316-011BLF

DIP316-011BLF

CONN IC DIP SOCKET 16POS GOLD

Amphenol ICC (FCI)

2,266 -
DIP316-011BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP324-011BLF

DIP324-011BLF

CONN IC DIP SOCKET 24POS GOLD

Amphenol ICC (FCI)

2,363 -
DIP324-011BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X20-001BLF

SIP1X20-001BLF

CONN SOCKET SIP 20POS GOLD

Amphenol ICC (FCI)

3,016 -
SIP1X20-001BLF

Техническая

Bulk SIP1x Obsolete SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
DIP314-001BLF

DIP314-001BLF

CONN IC DIP SOCKET 14POS GOLD

Amphenol ICC (FCI)

3,989 -
DIP314-001BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP324-001BLF

DIP324-001BLF

CONN IC DIP SOCKET 24POS GOLD

Amphenol ICC (FCI)

2,900 -
DIP324-001BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP316-001BLF

DIP316-001BLF

CONN IC DIP SOCKET 16POS GOLD

Amphenol ICC (FCI)

2,530 -
DIP316-001BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP316-014BLF

DIP316-014BLF

CONN IC DIP SOCKET 16POS TIN

Amphenol ICC (FCI)

3,950 -
DIP316-014BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X04-157BLF

SIP050-1X04-157BLF

CONN SOCKET SIP 4POS TIN

Amphenol ICC (FCI)

2,162 -
SIP050-1X04-157BLF

Техническая

Bulk SIP050-1x Obsolete SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X27-157BLF

SIP050-1X27-157BLF

CONN SOCKET SIP 27POS TIN

Amphenol ICC (FCI)

2,959 -
SIP050-1X27-157BLF

Техническая

Bulk SIP050-1x Obsolete SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X20-041BLF

SIP1X20-041BLF

CONN SOCKET SIP 20POS GOLD

Amphenol ICC (FCI)

2,309 -
SIP1X20-041BLF

Техническая

Bulk SIP1x Obsolete SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
DIP628-014BLF

DIP628-014BLF

CONN IC DIP SOCKET 28POS TIN

Amphenol ICC (FCI)

2,670 -
DIP628-014BLF

Техническая

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X18-157BLF

SIP050-1X18-157BLF

CONN SOCKET SIP 18POS TIN

Amphenol ICC (FCI)

2,421 -
SIP050-1X18-157BLF

Техническая

Bulk SIP050-1x Obsolete SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP306-001BLF

DIP306-001BLF

CONN IC DIP SOCKET 6POS GOLD

Amphenol ICC (FCI)

2,096 -
DIP306-001BLF

Техническая

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X02-157BLF

SIP050-1X02-157BLF

CONN SOCKET SIP 2POS TIN

Amphenol ICC (FCI)

3,218 -
SIP050-1X02-157BLF

Техническая

Bulk SIP050-1x Obsolete SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SPF080-1X04-998Z

SPF080-1X04-998Z

CONN SOCKET SIP 4POS TIN-LEAD

Amphenol ICC (FCI)

3,800 -
SPF080-1X04-998Z

Техническая

- SPF080-1x Obsolete SIP 4 (1 x 4) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame - - - - - -
SIP050-1X04-160BLF

SIP050-1X04-160BLF

CONN SOCKET SIP 4POS GOLD

Amphenol ICC (FCI)

3,348 -
SIP050-1X04-160BLF

Техническая

Bulk SIP050-1x Obsolete SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD