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制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
558-10-504M29-001104

558-10-504M29-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2,520 -
558-10-504M29-001104

Техническая

Bulk 558 Active BGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-504M29-001105

518-77-504M29-001105

CONN SOCKET PGA 504POS GOLD

Preci-Dip

3,608 -
518-77-504M29-001105

Техническая

Bulk 518 Active PGA 504 (29 x 29) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-83-576M30-001148

514-83-576M30-001148

CONN SOCKET BGA 576POS GOLD

Preci-Dip

3,323 -
514-83-576M30-001148

Техническая

Bulk 514 Active BGA 576 (30 x 30) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-500M30-001106

518-77-500M30-001106

CONN SOCKET PGA 500POS GOLD

Preci-Dip

2,755 -
518-77-500M30-001106

Техническая

Bulk 518 Active PGA 500 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
550-10-576M30-001152

550-10-576M30-001152

BGA SOLDER TAIL

Preci-Dip

2,660 -
550-10-576M30-001152

Техническая

Bulk 550 Active BGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-504M29-001106

518-77-504M29-001106

CONN SOCKET PGA 504POS GOLD

Preci-Dip

3,945 -
518-77-504M29-001106

Техническая

Bulk 518 Active PGA 504 (29 x 29) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-520M31-001104

558-10-520M31-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3,260 -
558-10-520M31-001104

Техническая

Bulk 558 Active BGA 520 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-520M31-001105

518-77-520M31-001105

CONN SOCKET PGA 520POS GOLD

Preci-Dip

2,758 -
518-77-520M31-001105

Техническая

Bulk 518 Active PGA 520 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-560M33-001101

558-10-560M33-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,771 -
558-10-560M33-001101

Техническая

Bulk 558 Active PGA 560 (33 x 33) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-83-600M35-001148

514-83-600M35-001148

CONN SOCKET BGA 600POS GOLD

Preci-Dip

2,823 -
514-83-600M35-001148

Техническая

Bulk 514 Active BGA 600 (35 x 35) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-520M31-001106

518-77-520M31-001106

CONN SOCKET PGA 520POS GOLD

Preci-Dip

3,632 -
518-77-520M31-001106

Техническая

Bulk 518 Active PGA 520 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
550-10-600M35-001152

550-10-600M35-001152

BGA SOLDER TAIL

Preci-Dip

3,957 -
550-10-600M35-001152

Техническая

Bulk 550 Active BGA 600 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-576M30-001101

558-10-576M30-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,898 -
558-10-576M30-001101

Техническая

Bulk 558 Active PGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-560M33-001104

558-10-560M33-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3,140 -
558-10-560M33-001104

Техническая

Bulk 558 Active BGA 560 (33 x 33) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-560M33-001105

518-77-560M33-001105

CONN SOCKET PGA 560POS GOLD

Preci-Dip

2,115 -
518-77-560M33-001105

Техническая

Bulk 518 Active PGA 560 (33 x 33) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-600M35-001101

558-10-600M35-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,156 -
558-10-600M35-001101

Техническая

Bulk 558 Active PGA 600 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-560M33-001106

518-77-560M33-001106

CONN SOCKET PGA 560POS GOLD

Preci-Dip

2,081 -
518-77-560M33-001106

Техническая

Bulk 518 Active PGA 560 (33 x 33) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-83-652M35-001148

514-83-652M35-001148

CONN SOCKET BGA 652POS GOLD

Preci-Dip

3,465 -
514-83-652M35-001148

Техническая

Bulk 514 Active BGA 652 (35 x 35) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-576M30-001104

558-10-576M30-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3,469 -
558-10-576M30-001104

Техническая

Bulk 558 Active BGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-576M30-001105

518-77-576M30-001105

CONN SOCKET PGA 576POS GOLD

Preci-Dip

2,951 -
518-77-576M30-001105

Техническая

Bulk 518 Active PGA 576 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD