Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-8870-10WR

14-8870-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,674 -
14-8870-10WR

Техническая

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
8114LB603 REV J

8114LB603 REV J

CONN TRANSIST TO-3 4POS TIN

Aavid, Thermal Division of Boyd Corporation

3,383 -
8114LB603 REV J

Техническая

Bulk 8180 Active Transistor, TO-3 4 (Oval) - Tin - Brass Through Hole Closed Frame Solder - Tin - Brass Phenolic
24-4518-00

24-4518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,894 -
24-4518-00

Техническая

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-00

17-0518-00

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,321 -
17-0518-00

Техническая

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-1518-10T

32-1518-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,924 -
32-1518-10T

Техническая

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
35-0518-10

35-0518-10

CONN SOCKET SIP 35POS GOLD

Aries Electronics

3,655 -
35-0518-10

Техническая

Bulk 518 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-624-41-004101

116-87-624-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,506 -
116-87-624-41-004101

Техническая

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-316-T-A

APA-316-T-A

ADAPTER PLUG

Samtec Inc.

2,562 -
Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-83-640-41-003101

116-83-640-41-003101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,293 -
116-83-640-41-003101

Техническая

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-012101

116-83-636-41-012101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,780 -
116-83-636-41-012101

Техническая

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
07-0503-20

07-0503-20

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,020 -
07-0503-20

Техническая

Bulk 0503 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
07-0503-30

07-0503-30

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,759 -
07-0503-30

Техническая

Bulk 0503 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
14-0518-11H

14-0518-11H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,735 -
14-0518-11H

Техническая

Bulk 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-1518-11H

14-1518-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,400 -
14-1518-11H

Техническая

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-0518-10T

32-0518-10T

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2,792 -
32-0518-10T

Техническая

Bulk 518 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-642-41-018101

116-83-642-41-018101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2,762 -
116-83-642-41-018101

Техническая

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-964-41-001101

110-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3,435 -
110-83-964-41-001101

Техническая

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-636-41-035101

146-83-636-41-035101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,888 -
146-83-636-41-035101

Техническая

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-636-41-036101

146-83-636-41-036101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,133 -
146-83-636-41-036101

Техническая

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-128-13-041101

510-87-128-13-041101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

2,002 -
510-87-128-13-041101

Техническая

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Общий 21991 Записывать«Предыдущая1... 173174175176177178179180...1100Следующий»
Домой

Домой

Продукты

Продукты

Телефон

Телефон

АБУТ

АБУТ

Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD