Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-10-037-10-061101

550-10-037-10-061101

PGA SOLDER TAIL

Preci-Dip

2,478 -
550-10-037-10-061101

Техническая

Bulk 550 Active PGA 37 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-318-T-N

APA-318-T-N

ADAPTER PLUG

Samtec Inc.

2,094 -
Tube APA Active - 18 (2 x 9) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
10-9513-10H

10-9513-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,036 -
10-9513-10H

Техническая

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0513-11

22-0513-11

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2,897 -
22-0513-11

Техническая

Bulk 0513 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-1518-11

34-1518-11

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3,379 -
34-1518-11

Техническая

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-308-G-N

APA-308-G-N

ADAPTER PLUG

Samtec Inc.

2,205 -
Tube APA Active - 8 (2 x 4) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-83-648-41-002101

116-83-648-41-002101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,885 -
116-83-648-41-002101

Техническая

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-007101

116-83-650-41-007101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3,812 -
116-83-650-41-007101

Техническая

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-3501-20

14-3501-20

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,405 -
14-3501-20

Техническая

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-3501-30

14-3501-30

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,587 -
14-3501-30

Техническая

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7250-10

02-7250-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

3,720 -
02-7250-10

Техническая

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7350-10

02-7350-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,839 -
02-7350-10

Техническая

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7400-10

02-7400-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

3,033 -
02-7400-10

Техническая

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7420-10

02-7420-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,651 -
02-7420-10

Техническая

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7425-10

02-7425-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,157 -
02-7425-10

Техническая

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
550-80-056-09-041101

550-80-056-09-041101

PGA SOLDER TAIL

Preci-Dip

2,832 -
550-80-056-09-041101

Техническая

Bulk 550 Active PGA 56 (9 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
36-6513-10T

36-6513-10T

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,687 -
36-6513-10T

Техническая

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-11

24-4518-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,938 -
24-4518-11

Техническая

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-71000-10

04-71000-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,630 -
04-71000-10

Техническая

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-652-41-007101

116-83-652-41-007101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,335 -
116-83-652-41-007101

Техническая

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Общий 21991 Записывать«Предыдущая1... 208209210211212213214215...1100Следующий»
Домой

Домой

Продукты

Продукты

Телефон

Телефон

АБУТ

АБУТ

Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD