Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-304-41-007000

116-43-304-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,653 -
116-43-304-41-007000

Техническая

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-320-G-J

APA-320-G-J

ADAPTER PLUG

Samtec Inc.

2,643 -
Tube APA Active - 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
32-0518-00

32-0518-00

CONN SOCKET SIP 32POS GOLD

Aries Electronics

3,258 -
32-0518-00

Техническая

Bulk 518 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6511-10

48-6511-10

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

2,359 -
48-6511-10

Техническая

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-0503-21

09-0503-21

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2,022 -
09-0503-21

Техническая

Bulk 0503 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
09-0503-31

09-0503-31

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3,032 -
09-0503-31

Техническая

Bulk 0503 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
40-6518-101

40-6518-101

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,093 -
40-6518-101

Техническая

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
104-13-304-41-780000

104-13-304-41-780000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2,371 -
104-13-304-41-780000

Техническая

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
10-2501-21

10-2501-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,577 -
10-2501-21

Техническая

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-2501-31

10-2501-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,772 -
10-2501-31

Техническая

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-9513-10T

40-9513-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,126 -
40-9513-10T

Техническая

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0511-10

18-0511-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

2,316 -
18-0511-10

Техническая

Bulk 511 Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-11

40-6518-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,202 -
40-6518-11

Техническая

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6513-11

32-6513-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,060 -
32-6513-11

Техническая

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-01

14-3518-01

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,696 -
14-3518-01

Техническая

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0508-20

17-0508-20

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,301 -
17-0508-20

Техническая

Bulk 508 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
17-0508-30

17-0508-30

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,414 -
17-0508-30

Техническая

Bulk 508 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
510-83-160-13-001101

510-83-160-13-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

3,170 -
510-83-160-13-001101

Техническая

Bulk 510 Active PGA 160 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
605-93-304-11-480000

605-93-304-11-480000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

2,607 -
605-93-304-11-480000

Техническая

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-304-11-480000

605-43-304-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,526 -
605-43-304-11-480000

Техническая

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Общий 21991 Записывать«Предыдущая1... 241242243244245246247248...1100Следующий»
Домой

Домой

Продукты

Продукты

Телефон

Телефон

АБУТ

АБУТ

Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD