Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-4508-21

24-4508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,994 -
24-4508-21

Техническая

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-31

24-4508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,893 -
24-4508-31

Техническая

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-21

24-6508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,996 -
24-6508-21

Техническая

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-31

24-6508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,254 -
24-6508-31

Техническая

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-3551-11

40-3551-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,350 -
40-3551-11

Техническая

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3552-11

40-3552-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,484 -
40-3552-11

Техническая

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3553-11

40-3553-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,368 -
40-3553-11

Техническая

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6551-11

40-6551-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

2,388 -
40-6551-11

Техническая

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6552-11

40-6552-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,837 -
40-6552-11

Техническая

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6553-11

40-6553-11

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2,022 -
40-6553-11

Техническая

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3554-11

40-3554-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

2,599 -
40-3554-11

Техническая

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
38-0508-21

38-0508-21

CONN SOCKET SIP 38POS GOLD

Aries Electronics

2,928 -
38-0508-21

Техническая

Bulk 508 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
38-0508-31

38-0508-31

CONN SOCKET SIP 38POS GOLD

Aries Electronics

2,842 -
38-0508-31

Техническая

Bulk 508 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
38-1508-21

38-1508-21

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,912 -
38-1508-21

Техническая

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
38-1508-31

38-1508-31

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,323 -
38-1508-31

Техническая

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
32-3570-11

32-3570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

2,879 -
32-3570-11

Техническая

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3571-11

32-3571-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

2,426 -
32-3571-11

Техническая

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3572-11

32-3572-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

3,494 -
32-3572-11

Техническая

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3573-11

32-3573-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

2,192 -
32-3573-11

Техническая

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3575-11

32-3575-11

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

2,478 -
32-3575-11

Техническая

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
Общий 4324 Записывать«Предыдущая1... 165166167168169170171172...217Следующий»
Домой

Домой

Продукты

Продукты

Телефон

Телефон

АБУТ

АБУТ

Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD