Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-81250-210C

06-81250-210C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,577 -
06-81250-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-81250-210C

08-81250-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,875 -
08-81250-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8255-210C

08-8255-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,645 -
08-8255-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8300-210C

08-8300-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,599 -
08-8300-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8343-210C

08-8343-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,059 -
08-8343-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8430-210C

08-8430-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,498 -
08-8430-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8460-210C

08-8460-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,312 -
08-8460-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8550-210C

08-8550-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,068 -
08-8550-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8620-210C

08-8620-210C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,405 -
08-8620-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-81000-210C

10-81000-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,819 -
10-81000-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-81250-210C

10-81250-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,879 -
10-81250-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8240-210C

10-8240-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,940 -
10-8240-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8285-210C

10-8285-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,061 -
10-8285-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8300-210C

10-8300-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,486 -
10-8300-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8350-210C

10-8350-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,246 -
10-8350-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8440-210C

10-8440-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,774 -
10-8440-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8500-210C

10-8500-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,131 -
10-8500-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8535-210C

10-8535-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,331 -
10-8535-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8600-210C

10-8600-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,263 -
10-8600-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8620-210C

10-8620-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,324 -
10-8620-210C

Техническая

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Общий 4324 Записывать«Предыдущая1... 210211212213214215216217Следующий»
Shenzhen Yuecheng electronic Commerce Co., LTD

Домой

Shenzhen Yuecheng electronic Commerce Co., LTD

Продукты

Shenzhen Yuecheng electronic Commerce Co., LTD

Телефон

Shenzhen Yuecheng electronic Commerce Co., LTD

АБУТ

Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD