Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-91-420-41-006000

116-91-420-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,537 -
116-91-420-41-006000

Техническая

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-642-41-001000

110-91-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

2,344 -
110-91-642-41-001000

Техническая

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-642-41-001000

110-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,110 -
110-41-642-41-001000

Техническая

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-210-41-004000

612-43-210-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,519 -
612-43-210-41-004000

Техническая

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-210-41-004000

612-93-210-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,266 -
612-93-210-41-004000

Техническая

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-43-318-41-001000

210-43-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,771 -
210-43-318-41-001000

Техническая

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-93-318-41-001000

210-93-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,056 -
210-93-318-41-001000

Техническая

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-308-31-018000

614-93-308-31-018000

SOCKET CARRIER LOWPRO .300 8POS

Mill-Max Manufacturing Corp.

3,967 -
614-93-308-31-018000

Техническая

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-308-31-018000

614-43-308-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,669 -
614-43-308-31-018000

Техническая

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-636-41-003000

115-44-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,442 -
115-44-636-41-003000

Техническая

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-318-41-117000

114-41-318-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,206 -
114-41-318-41-117000

Техническая

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-318-41-117000

114-91-318-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,701 -
114-91-318-41-117000

Техническая

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-152-31-018000

714-43-152-31-018000

CONN SOCKET SIP 52POS GOLD

Mill-Max Manufacturing Corp.

3,888 -
714-43-152-31-018000

Техническая

Bulk 714 Active SIP 52 (1 x 52) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-306-41-002000

124-93-306-41-002000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3,023 -
124-93-306-41-002000

Техническая

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-306-41-002000

124-43-306-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,101 -
124-43-306-41-002000

Техническая

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-105-41-005000

317-93-105-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

2,438 -
317-93-105-41-005000

Техническая

Tube 317 Active SIP 5 (1 x 5) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-324-41-003000

115-91-324-41-003000

SOCKET IC OPEN LOWPRO .300 24POS

Mill-Max Manufacturing Corp.

2,885 -
Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-91-624-41-003000

115-91-624-41-003000

SOCKET IC OPEN LOWPRO .600 24POS

Mill-Max Manufacturing Corp.

3,114 -
Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-324-41-003000

115-41-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,912 -
115-41-324-41-003000

Техническая

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-624-41-003000

115-41-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,217 -
115-41-624-41-003000

Техническая

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD