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制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
2201838-1

2201838-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

269 -
2201838-1

Техническая

Bulk - Last Time Buy LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1-2324271-2

1-2324271-2

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

2,972 -
1-2324271-2

Техническая

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1-2324271-1

1-2324271-1

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

114 -
1-2324271-1

Техническая

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
3-1571550-0

3-1571550-0

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

704 -
3-1571550-0

Техническая

Tube 500 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2319757-1

2319757-1

DUAL LGA,257 POS, DMD SOCKET

TE Connectivity AMP Connectors

913 -
2319757-1

Техническая

Tray DMD Active LGA 257 (20 x 30) 0.039 (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic
8080-1G1-LF

8080-1G1-LF

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

379 -
8080-1G1-LF

Техническая

Bulk 8080 Active Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE)
1-2324271-6

1-2324271-6

LEFT SEGMEN LGA4189-5 SOCKET-P5

TE Connectivity AMP Connectors

165 -
1-2324271-6

Техническая

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1-2324271-5

1-2324271-5

RIGHT SEGMEN LGA4189-5 SOCKET-P5

TE Connectivity AMP Connectors

163 -
1-2324271-5

Техническая

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
2-2129710-7

2-2129710-7

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

154 -
2-2129710-7

Техническая

Tray - Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic
4-1571552-2

4-1571552-2

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

1,704 -
4-1571552-2

Техническая

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
808-AG11D-LF

808-AG11D-LF

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

2,657 -
808-AG11D-LF

Техническая

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571551-2

2-1571551-2

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

4,214 -
2-1571551-2

Техническая

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
520-AG11D-ES

520-AG11D-ES

DIP SOCKET T/H 20POS

TE Connectivity AMP Connectors

867 -
520-AG11D-ES

Техническая

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
4-1571552-6

4-1571552-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

1,786 -
4-1571552-6

Техническая

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1-1571552-2

1-1571552-2

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors

142 -
1-1571552-2

Техническая

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
816-AG11D

816-AG11D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

960 -
816-AG11D

Техническая

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
516-AG12D-LF

516-AG12D-LF

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

1,173 -
516-AG12D-LF

Техническая

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
822-AG11D

822-AG11D

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

1,669 -
822-AG11D

Техническая

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
818-AG11D

818-AG11D

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

432 -
818-AG11D

Техническая

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
1-1571994-0

1-1571994-0

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

118 -
1-1571994-0

Техническая

Tube 510 Obsolete SIP 10 (1 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD