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| Фото | Производитель Часть # | Доступность | Цена | Количество | Техническая | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD2190SOLDER SPHERES 63/37 .020 DIAM |
3,586 | - |
|
Техническая |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
1354250LOCTITE WS 300 97SCT3V 500G SEMC |
2,485 | - |
|
Bulk | WS300 | Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Syringe, 2.65 oz (75g) | 6 Months | Date of Manufacture | |
|
|
1354291LOCTITE WS 300 97SCT3V 500G JAR |
3,668 | - |
|
Bulk | WS300 | Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | |
|
SSLFNC-250GSAC 305 LEAD FREE SOLDER PASTE T |
2,885 | - |
|
Техническая |
Bag | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD2165SOLDER SPHERES 63/37 .012 DIAM |
3,420 | - |
|
Техническая |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.012 (0.31mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD4300AX500T3CSOLDER PASTE 63/37 T3 500G |
2,447 | - |
|
Техническая |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
TS991AX500T4SOLDER PASTE THERMALLY STABLE NC |
3,975 | - |
|
Техническая |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SSLFNC-T5-250GSAC 305 LEAD FREE SOLDER PASTE T |
2,534 | - |
|
Техническая |
Bag | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD291SNL500T3SOLDER PASTE SAC305 500G |
2,743 | - |
|
Техническая |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMD2060SOLDER SPHERES SAC305 .030 DIAM |
2,114 | - |
|
Техническая |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.030 (0.76mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2050SOLDER SPHERES SAC305 .024 DIAM |
2,340 | - |
|
Техническая |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.024 (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2055SOLDER SPHERES SAC305 .025 DIAM |
3,357 | - |
|
Техническая |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025 (0.64mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
|
1405650LOCTITE WS 300 97SCDAP88V 500G J |
3,767 | - |
|
Bulk | WS300 | Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | |
|
|
1405673LOCTITE WS 300 97SCDAP88V 500G S |
2,762 | - |
|
Bulk | WS300 | Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | |
|
NC191LT500CSMOOTH FLOW LOW TEMP SOLDER PAST |
2,509 | - |
|
Техническая |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | - | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
|
MMF006622361-40R SOLDER TIN-LEAD, 1 LB |
2,259 | - |
|
Техническая |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.040 (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMD291AX500T4CSOLDER PASTE 63/37 T4 500G |
3,770 | - |
|
Техническая |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD4300AX500T4CSOLDER PASTE 63/37 T4 500G |
2,073 | - |
|
Техническая |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMDLTLFP500T3SOLDER PASTE SN42/BI58 500G |
3,055 | - |
|
Техническая |
Jar | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
4900P-250GLEADED NO CLEAN SOLDER PASTE |
3,054 | - |
|
Техническая |
Bulk | 4900 | Active | Solder Paste | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | - | 423 ~ 430°F (217 ~ 221°C) | No-Clean | - | - | Lead Free | Jar, 8.8 oz (250g) | 24 Months | Date of Manufacture |
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