Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
03-0508-30

03-0508-30

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,881 -
03-0508-30

Техническая

Bulk 508 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
117-87-624-41-105101

117-87-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,043 -
117-87-624-41-105101

Техническая

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-310-11-001101

299-87-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,573 -
299-87-310-11-001101

Техническая

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-009101

116-87-318-41-009101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,737 -
116-87-318-41-009101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-320-41-035101

146-87-320-41-035101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,965 -
146-87-320-41-035101

Техническая

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-320-41-036101

146-87-320-41-036101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,613 -
146-87-320-41-036101

Техническая

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-801101

110-83-316-41-801101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,171 -
110-83-316-41-801101

Техническая

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-328-41-001101

115-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,016 -
Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-428-41-005101

117-83-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,569 -
117-83-428-41-005101

Техническая

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-628-41-005101

117-83-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,793 -
117-83-628-41-005101

Техническая

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-322-41-001101

612-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,262 -
612-83-322-41-001101

Техническая

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
05-0518-11H

05-0518-11H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,928 -
05-0518-11H

Техническая

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-10H

11-0518-10H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,853 -
11-0518-10H

Техническая

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-10

13-0518-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,484 -
13-0518-10

Техническая

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
ICO-308-LTT

ICO-308-LTT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

3,860 -
ICO-308-LTT

Техническая

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
146-83-316-41-035101

146-83-316-41-035101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,848 -
146-83-316-41-035101

Техническая

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-316-41-036101

146-83-316-41-036101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,661 -
146-83-316-41-036101

Техническая

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-007101

116-83-316-41-007101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,762 -
116-83-316-41-007101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-428-41-005101

110-83-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,826 -
110-83-428-41-005101

Техническая

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-628-41-005101

110-83-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,843 -
110-83-628-41-005101

Техническая

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD