Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-628-41-605101

110-83-628-41-605101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,739 -
110-83-628-41-605101

Техническая

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
PX-52LCC

PX-52LCC

LEADLESS CHIP CARRIER 52P PBT RO

Kycon, Inc.

3,165 -
Tube PX Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
SMPX-68LCC-N

SMPX-68LCC-N

SMT PLCC SOCKET 68P NON POLARISE

Kycon, Inc.

3,606 -
SMPX-68LCC-N

Техническая

Tube SMPX Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
SMPX-68LCC-P

SMPX-68LCC-P

SMT PLCC SOCKET 68P POLARISED RO

Kycon, Inc.

2,537 -
SMPX-68LCC-P

Техническая

Tube SMPX Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
114-83-318-41-134191

114-83-318-41-134191

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,865 -
Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-006101

116-87-424-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,717 -
116-87-424-41-006101

Техническая

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-420-31-012101

614-83-420-31-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,989 -
614-83-420-31-012101

Техническая

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-052-24-008

540-88-052-24-008

CONN SOCKET PLCC 52POS TIN

Preci-Dip

3,792 -
540-88-052-24-008

Техническая

Bulk 540 Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
10-2513-10T

10-2513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,994 -
10-2513-10T

Техническая

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-3513-10T

10-3513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,593 -
10-3513-10T

Техническая

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0518-11

09-0518-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2,986 -
09-0518-11

Техническая

Bulk 518 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0518-10T

12-0518-10T

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3,148 -
12-0518-10T

Техническая

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-10T

12-1518-10T

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,782 -
12-1518-10T

Техническая

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-320-41-002101

116-87-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,468 -
116-87-320-41-002101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-036-06-000101

510-83-036-06-000101

CONN SOCKET PGA 36POS GOLD

Preci-Dip

3,995 -
510-83-036-06-000101

Техническая

Bulk 510 Active PGA 36 (6 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-018101

116-83-420-41-018101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,569 -
116-83-420-41-018101

Техническая

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-422-41-105101

110-83-422-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,860 -
110-83-422-41-105101

Техническая

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
214-99-308-01-670799

214-99-308-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

2,593 -
Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
214-44-308-01-670799

214-44-308-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

2,384 -
Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
410-83-224-10-001101

410-83-224-10-001101

CONN ZIG-ZAG 24POS GOLD

Preci-Dip

2,142 -
410-83-224-10-001101

Техническая

Bulk 410 Active Zig-Zag, Left Stackable 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD