Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-87-428-31-012101

614-87-428-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,988 -
614-87-428-31-012101

Техническая

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICF-314-T-O-TR

ICF-314-T-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

3,312 -
Tape & Reel (TR) iCF Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
122-87-322-41-001101

122-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,593 -
122-87-322-41-001101

Техническая

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-422-41-001101

122-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,032 -
122-87-422-41-001101

Техническая

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-322-41-001101

123-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,380 -
123-87-322-41-001101

Техническая

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-422-41-001101

123-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,805 -
123-87-422-41-001101

Техническая

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-002101

116-87-420-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,884 -
116-87-420-41-002101

Техническая

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-324-41-001101

612-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,004 -
612-83-324-41-001101

Техническая

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-004101

116-87-210-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,368 -
116-87-210-41-004101

Техническая

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-3513-10T

12-3513-10T

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,827 -
12-3513-10T

Техническая

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-00

08-0518-00

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3,032 -
08-0518-00

Техническая

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-00

08-1518-00

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,677 -
08-1518-00

Техническая

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-10T

13-0518-10T

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,292 -
13-0518-10T

Техническая

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-312-41-105191

110-83-312-41-105191

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,428 -
Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 40-HZL/07-TT

AR 40-HZL/07-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

3,262 -
AR 40-HZL/07-TT

Техническая

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
116-87-318-41-001101

116-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,027 -
116-87-318-41-001101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-608-10-002101

299-87-608-10-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,349 -
299-87-608-10-002101

Техническая

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-628-41-001101

115-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,663 -
Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-003101

116-87-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,269 -
116-87-328-41-003101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-628-41-003101

115-83-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,357 -
115-83-628-41-003101

Техническая

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD