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IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
232-5205-01

232-5205-01

CONN SOCKET QFN 32POS GOLD

3M

2,291 -
232-5205-01

Техническая

Bulk Textool™ Active QFN 32 (4 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
240-5205-01

240-5205-01

CONN SOCKET QFN 40POS GOLD

3M

3,088 -
240-5205-01

Техническая

Bulk Textool™ Active QFN 40 (4 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
4832-6004-CP

4832-6004-CP

CONN IC DIP SOCKET 32POS TIN

3M

1,424 -
4832-6004-CP

Техническая

Tube 4800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
8432-21A1-RK-TP

8432-21A1-RK-TP

CONN SOCKET PLCC 32POS TIN

3M

1,052 -
8432-21A1-RK-TP

Техническая

Tube 8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
200-6313-9UN-1900

200-6313-9UN-1900

CONN SOCKET PGA ZIF 169POS GOLD

3M

119 -
200-6313-9UN-1900

Техническая

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
200-6315-9UN-1900

200-6315-9UN-1900

CONN SOCKET PGA ZIF 225POS GOLD

3M

3,413 -
200-6315-9UN-1900

Техническая

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100 (2.54mm) - - - - - - 0.100 (2.54mm) - - - Polyethersulfone (PES)
200-6319-9UN-1900

200-6319-9UN-1900

CONN SOCKET PGA ZIF 361POS GOLD

3M

125 -
200-6319-9UN-1900

Техническая

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
200-6321-9UN-1900

200-6321-9UN-1900

CONN SOCKET PGA ZIF 441POS GOLD

3M

3,519 -
200-6321-9UN-1900

Техническая

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
264-1300-00-0602J

264-1300-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

3M

3,831 -
264-1300-00-0602J

Техническая

Tube Textool™ Active DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
4824-6004-CP

4824-6004-CP

CONN IC DIP SOCKET 24POS TIN

3M

240 -
4824-6004-CP

Техническая

Tube 4800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
4828-3004-CP

4828-3004-CP

CONN IC DIP SOCKET 28POS TIN

3M

481 -
4828-3004-CP

Техническая

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
8420-11B1-RK-TP

8420-11B1-RK-TP

CONN SOCKET PLCC 20POS TIN

3M

706 -
8420-11B1-RK-TP

Техническая

Tube 8400 Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8428-21B1-RK-TP

8428-21B1-RK-TP

CONN SOCKET PLCC 28POS TIN

3M

638 -
8428-21B1-RK-TP

Техническая

Tube 8400 Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8444-21A1-RK-TP

8444-21A1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

831 -
8444-21A1-RK-TP

Техническая

Tube 8400 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8452-21A1-RK-TP

8452-21A1-RK-TP

CONN SOCKET PLCC 52POS TIN

3M

581 -
8452-21A1-RK-TP

Техническая

Tube 8400 Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8468-21B1-RK-TP

8468-21B1-RK-TP

CONN SOCKET PLCC 68POS TIN

3M

926 -
8468-21B1-RK-TP

Техническая

Tube 8400 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8484-21B1-RK-TP

8484-21B1-RK-TP

CONN SOCKET PLCC 84POS TIN

3M

107 -
8484-21B1-RK-TP

Техническая

Tube 8400 Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
4820-3000-CP

4820-3000-CP

CONN IC DIP SOCKET 20POS TIN

3M

246 -
4820-3000-CP

Техническая

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
218-3341-00-0602J

218-3341-00-0602J

CONN IC DIP SOCKET ZIF 18POS GLD

3M

3,167 -
218-3341-00-0602J

Техническая

Tray Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
222-3343-00-0602J

222-3343-00-0602J

CONN IC DIP SOCKET ZIF 22POS GLD

3M

3,739 -
222-3343-00-0602J

Техническая

Tube Textool™ Active DIP, ZIF (ZIP), 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD