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IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
228-1277-00-0602J

228-1277-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

3,711 -
228-1277-00-0602J

Техническая

Bulk,Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
224-1286-00-0602J

224-1286-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

2,483 -
224-1286-00-0602J

Техническая

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
224-5248-00-0602J

224-5248-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

3,450 -
224-5248-00-0602J

Техническая

Bulk Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-1371-00-0602J

228-1371-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

2,473 -
228-1371-00-0602J

Техническая

Tray Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
240-3639-00-0602J

240-3639-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M

3,997 -
240-3639-00-0602J

Техническая

Bulk Textool™ Active DIP, ZIF (ZIP), 1.0 (25.40mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
220-7201-55-1902

220-7201-55-1902

CONN SOCKET SOIC 20POS GOLD

3M

2,373 -
220-7201-55-1902

Техническая

Bulk Textool™ Active SOIC 20 (2 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
264-4493-00-0602J

264-4493-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

3M

3,098 -
264-4493-00-0602J

Техническая

Tube Textool™ Active DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
248-5205-00

248-5205-00

CONN SOCKET QFN 48POS GOLD

3M

3,343 -
248-5205-00

Техническая

Bulk Textool™ Active QFN 48 (4 x 12) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
224-5205-01

224-5205-01

CONN SOCKET QFN 24POS GOLD

3M

3,435 -
224-5205-01

Техническая

Bulk Textool™ Active QFN 24 (4x4) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES)
228-5204-01

228-5204-01

CONN SOCKET QFN 28POS GOLD

3M

2,190 -
228-5204-01

Техническая

Bulk Textool™ Active QFN 28 (4 x 7) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES)
248-5205-01

248-5205-01

CONN SOCKET QFN 48POS GOLD

3M

2,558 -
248-5205-01

Техническая

Bulk Textool™ Active QFN 48 (4 x 12) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
264-5205-01

264-5205-01

CONN SOCKET QFN 64POS GOLD

3M

2,095 -
264-5205-01

Техническая

Bulk Textool™ Active QFN 64 (4 x 16) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020 (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES)
224-5809-00-0602

224-5809-00-0602

CONN SOCKET SIP ZIF 24POS GOLD

3M

3,527 -
224-5809-00-0602

Техническая

Bulk Textool™ Active SIP, ZIF (ZIP) 24 (1 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
8468-21A1-RK-TP

8468-21A1-RK-TP

CONN SOCKET PLCC 68POS TIN

3M

114 -
8468-21A1-RK-TP

Техническая

Tube 8400 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
232-1285-00-0602J

232-1285-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

3M

3,119 -
232-1285-00-0602J

Техническая

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-1290-00-0602J

228-1290-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

3,996 -
228-1290-00-0602J

Техническая

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
242-1281-00-0602J

242-1281-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M

2,469 -
242-1281-00-0602J

Техническая

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-4817-00-0602J

228-4817-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

2,207 -
228-4817-00-0602J

Техническая

Bulk Textool™ Active DIP, ZIF (ZIP), 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
256-1292-00-0602J

256-1292-00-0602J

CONN IC DIP SOCKET ZIF 56POS GLD

3M

3,668 -
256-1292-00-0602J

Техническая

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-7396-55-1902

228-7396-55-1902

CONN SOCKET SOIC 28POS GOLD

3M

2,129 -
228-7396-55-1902

Техническая

Bulk Textool™ Active SOIC 28 (2 x 14) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD