Shenzhen Yuecheng electronic Commerce Co., LTD+86 15815556552

IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-43-624-41-801000

123-43-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

199 -
123-43-624-41-801000

Техническая

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8058-1G23

8058-1G23

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

1,171 -
8058-1G23

Техническая

Bulk 8058 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
8060-1G3

8060-1G3

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

995 -
8060-1G3

Техническая

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
8058-1G24

8058-1G24

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

749 -
8058-1G24

Техническая

Bulk 8058 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Panel Mount - Solder Cup - Gold - Brass Polytetrafluoroethylene (PTFE)
2041549-1

2041549-1

SOCKET ASSY, DMD 350, T/R, G/F

TE Connectivity AMP Connectors

658 -
Tape & Reel (TR),Cut Tape (CT) DMD Active PGA, ZIF (ZIP) 350 (35 x 36) 0.050 (1.27mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin-Lead - Copper Alloy Liquid Crystal Polymer (LCP), Glass Filled
ICF-632-S-O-TR

ICF-632-S-O-TR

CONN IC DIP SOCKET 32POS TIN

Samtec Inc.

273 -
ICF-632-S-O-TR

Техническая

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
12-8473-310C

12-8473-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

170 -
12-8473-310C

Техническая

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-43-668-41-005000

117-43-668-41-005000

CONN IC DIP SOCKET 68POS GOLD

Mill-Max Manufacturing Corp.

198 -
117-43-668-41-005000

Техническая

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8060-1G12

8060-1G12

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

1,104 -
8060-1G12

Техническая

Bulk 8060 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP)
8060-1G11

8060-1G11

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

3,869 -
8060-1G11

Техническая

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
2350616-1

2350616-1

DUAL LGA,250 POS, DMD SOCKET

TE Connectivity AMP Connectors

451 -
2350616-1

Техническая

Tray - Active LGA 250 (16 x 25) 0.039 (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic
299-43-632-10-002000

299-43-632-10-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

351 -
299-43-632-10-002000

Техническая

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8059-2G9

8059-2G9

CONN TRANSIST TO-5 10POS GOLD

TE Connectivity AMP Connectors

1,052 -
8059-2G9

Техническая

Bulk 8059 Obsolete Transistor, TO-5 10 (Round) - Gold - Copper Alloy Through Hole - Solder - Gold - Copper Alloy Polyamide (PA), Nylon, Glass Filled
116-93-308-41-007000

116-93-308-41-007000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,264 -
116-93-308-41-007000

Техническая

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-314-41-105000

110-43-314-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

110 -
110-43-314-41-105000

Техническая

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-310-41-105000

110-93-310-41-105000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2,270 -
110-93-310-41-105000

Техническая

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
101-93-422-41-560000

101-93-422-41-560000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

486 -
101-93-422-41-560000

Техническая

Tube 101 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-318-41-007000

116-93-318-41-007000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

892 -
116-93-318-41-007000

Техническая

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8060-1G5

8060-1G5

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

184 -
8060-1G5

Техническая

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
123-93-320-41-801000

123-93-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

150 -
123-93-320-41-801000

Техническая

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD