+86 15815556552IC, транзисторная розетка
| Фото | Производитель Часть # | Доступность | Цена | Количество | Техническая | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
105190-00017.50 BY 7.50MM CAMERA SOCKET, 4. |
13,200 | - |
|
Техническая |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
47337-00018.50 BY 8.50MM CAMERA SOCKET, 4. |
17,547 | - |
|
Техническая |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
105199-00018.50 BY 9.50MM CAMERA SOCKET, 4. |
2,100 | - |
|
Техническая |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
78499-00026.50 BY 6.50MM CAMERA SOCKET, 3. |
1,200 | - |
|
Техническая |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
105200-00085.50 BY 5.50MM CAMERA SOCKET, 3. |
1,800 | - |
|
Техническая |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
78725-0002SMIA85 CAMERA SOCKET T/BRD 18PIN |
1,400 | - |
|
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
47593-90001.01MM PITCH LGA 1366 PROCESSOR |
441 | - |
|
Техническая |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
47594-00021.01MM BY 1.01MM PITCH LGA 1366 |
2,586 | - |
|
Техническая |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
245-14-1-03CONN IC DIP SOCKET 14POS TIN |
635 | - |
|
Техническая |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
243-18-1-03CONN IC DIP SOCKET 18POS TIN |
702 | - |
|
Техническая |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
540-44-044-17-400000CONN SOCKET PLCC 44POS TIN |
865 | - |
|
Техническая |
Tube | 540 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Polyphenylene Sulfide (PPS) |
|
1-1814655-5CONN SOCKET SIP 20POS GOLD |
4,978 | - |
|
Техническая |
Bulk | - | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester |
|
264-1300-00-0602JCONN IC DIP SOCKET ZIF 64POS GLD |
3,831 | - |
|
Техническая |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
245-18-1-03CONN IC DIP SOCKET 18POS TIN |
416 | - |
|
Техническая |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-306-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 6P |
360 | - |
|
Техническая |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
110-47-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
521 | - |
|
Техническая |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
A 40-LC-TRCONN IC DIP SOCKET 40POS TIN |
422 | - |
|
Техническая |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
DILB18P-223TLFCONN IC DIP SOCKET 18POS TINLEAD |
446 | - |
|
Техническая |
Tube | DILB | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
110-93-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
2,980 | - |
|
Техническая |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-93-320-41-001000CONN IC DIP SOCKET 20POS GOLD |
1,807 | - |
|
Техническая |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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- Надежная упаковка для вашего товара.
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