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IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-87-324-41-001151

110-87-324-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,337 -
Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-424-41-001101

110-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,928 -
110-87-424-41-001101

Техническая

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-318-41-001101

115-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,631 -
Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-210-01-839101

110-83-210-01-839101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,368 -
110-83-210-01-839101

Техническая

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 8 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-312-41-001101

115-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,949 -
Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-009101

116-87-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,641 -
116-87-308-41-009101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-0518-00

04-0518-00

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,359 -
04-0518-00

Техническая

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-11

04-0518-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2,872 -
04-0518-11

Техническая

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-11

04-1518-11

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2,282 -
04-1518-11

Техническая

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10T

05-0518-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2,792 -
05-0518-10T

Техническая

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-310-41-001101

614-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,117 -
614-83-310-41-001101

Техническая

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-006101

116-83-210-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,207 -
116-83-210-41-006101

Техническая

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-018101

116-87-312-41-018101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2,683 -
116-87-312-41-018101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-210-41-105101

110-83-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,793 -
110-83-210-41-105101

Техническая

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-012101

116-87-310-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,919 -
116-87-310-41-012101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-012101

116-87-610-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,217 -
116-87-610-41-012101

Техническая

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SMPX-20LCC-N-TR

SMPX-20LCC-N-TR

SMT PLCC 20P NON POLARISED, T&R

Kycon, Inc.

3,326 -
SMPX-20LCC-N-TR

Техническая

Tape & Reel (TR) SMPX Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
110-83-314-41-001101

110-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,979 -
110-83-314-41-001101

Техническая

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-105101

110-87-314-41-105101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,916 -
110-87-314-41-105101

Техническая

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-314-41-001101

614-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,644 -
614-87-314-41-001101

Техническая

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD