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IC, транзисторная розетка

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фото Производитель Часть # Доступность Цена Количество Техническая Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-87-314-41-001101

612-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,749 -
612-87-314-41-001101

Техническая

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-10-002101

110-83-314-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,386 -
110-83-314-10-002101

Техническая

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-003101

116-87-312-41-003101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,684 -
116-87-312-41-003101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-105161

110-87-314-41-105161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,262 -
110-87-314-41-105161

Техническая

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-006101

116-87-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,258 -
116-87-314-41-006101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-012101

116-83-308-41-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,503 -
116-83-308-41-012101

Техническая

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-308-41-001101

121-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,744 -
121-83-308-41-001101

Техническая

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-105161

110-83-310-41-105161

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,208 -
110-83-310-41-105161

Техническая

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-308-41-001101

122-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,807 -
122-83-308-41-001101

Техническая

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-308-41-001101

123-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,412 -
123-83-308-41-001101

Техническая

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-322-41-005101

110-87-322-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,638 -
110-87-322-41-005101

Техническая

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-422-41-005101

110-87-422-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,954 -
110-87-422-41-005101

Техническая

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-422-41-605101

110-87-422-41-605101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,856 -
110-87-422-41-605101

Техническая

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-306-41-002101

124-83-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,417 -
Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-310-41-001101

122-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,517 -
122-87-310-41-001101

Техническая

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-310-41-001101

123-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,336 -
123-87-310-41-001101

Техническая

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-310-41-134191

114-83-310-41-134191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,127 -
Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D00-044-490-001

D00-044-490-001

CONN SOCKET PLCC 44POS TIN-LEAD

EDAC Inc.

3,627 -
D00-044-490-001

Техническая

Tube D00 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin-Lead 150.0µin (3.81µm) - Surface Mount Closed Frame - - - - - -
116-87-210-41-018101

116-87-210-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,756 -
116-87-210-41-018101

Техническая

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-210-31-012101

614-83-210-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,899 -
614-83-210-31-012101

Техническая

Bulk 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Shenzhen Yuecheng electronic Commerce Co., LTD
Shenzhen Yuecheng electronic Commerce Co., LTD